Nexeed
    • Introduction
    • User manual
      • Basic operation
        • Basic interaction elements
        • Filter tables via filter dialog
        • Search for materials
        • Export results table
        • Adjust table columns
        • Configuring a scanner
      • Material Info
        • Material Details tab
        • Blocks tab
        • MSD Info tab
        • Monitoring tab
        • Material History tab
        • Setup History tab
      • Material search
        • Label by ID tab
        • Material by ID tab
        • Extended Search tab
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        • Dry Box Content tab
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        • Details of an event
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        • Start a Monitoring Process
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        • Monitoring Details page
        • State and state changes
          • Single Stage Thawing
          • Dual Stage Thawing
          • Solder Paste Monitoring
        • Roles And Resources for Material Monitoring
      • Configuration
        • Blocking Rules tab
        • On Setup Label Creation Rules tab
        • Displaying and Editing the Configuration File
        • Monitoring Location Definitions tab
        • Monitoring Process Definitions tab
        • Printer Settings tab
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      • Desktop Clients
        • Material InfoPanel Desktop Client
        • Mat Climate Control Desktop Client
    • API documentation
      • HTTP API
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    • Glossary
Material Management
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Nexeed Learning Portal

  • Material Management
  • User manual
  • Material Info
  • MSD Info tab

MSD Info tab

Moisture from the room climate can influence the durability of additional components and must be monitored during the production process. These moisture-sensitive devices are only permitted to be exposed to an unprotected environment for a limited period of time. This time is referred to as the exposure time. Materials that have exceeded their exposure time are blocked from production.

The moisture sensitivity level defines how long a material is permitted to remain in an unprotected environment. If the material is stored in a protected environment (e.g. a dry box), the exposure time can be stopped depending on the MSL.

Total exposure time, remaining processing time and last possible processing date are recalculated if the exposure time is adjusted.

Abbreviation Meaning

MSD

Moisture Sensitive Device

MSL

Moisture Sensitivity Level

matm_msd_info

Page content

Element/icon Description

Total exposure time

Sum of the exposure times

Floor Life

Defines how long a material can be exposed outside a protected environment.

Time buffer

A time buffer is a location and type related time span that shortens the material’s standard defined maximum exposure time.

Remaining processing time

The remaining processing time for the material calculated based on the exposure time and floor life.

Last possible processing date

The time until the material can be processed.

Material Expiration Date

The date when the material expires.

Pie Chart

Provides a quick overview of the total exposure time, remaining processing time and time buffer data.

Event table

Provides a list of events that happened to the material.

Table header

Element/icon Description

<nn> items

Total number of entries found

sort-alphabetically Sort

Sort table columns by Repackage timestamp in ascending or descending order.

refresh Refresh

Update table.

Adjust exposure time

Prerequisites

  • MaterialManagement Expert or MaterialManagement Administrator role

  • The material is stored in a protected environment, for example, a dry box.

Procedure

  1. Search for material using one of the following options:

    • Material by ID tab

    • MSD Statistics tab

    • Dry Box Content tab

    • Extended Search tab

  2. Open the MSD information tab.

  3. In the New exposure time field, enter the new exposure time in dd-HH format.

  4. Click on Save.

  5. In the dialog, click on Confirm.

The new exposure time is saved.

The values in the Total exposure time, Remaining processing time and Last possible processing date fields are adjusted.

The pie chart is adjusted.

The manual adjustment is displayed in the results table and in the Material history tab: Material History tab.

Contents

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